| http://www.w3.org/ns/prov#value | - FIG. 1A is a top view, FIG. 1B is a sectional view, and FIG. 1C is an enlarged view of FIG. 1B. [0006] As shown in FIG. 1A, in a conventional bump transfer plate 121, solder bumps 122 of eutectic solder or high melting point solder are formed on a base 123 made of Al or stainless steel.
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