| http://www.w3.org/ns/prov#value | - Another object of the present invention is a method of forming highly uniform metal pillars in a high density multilayer electrical interconnect (e.g. copper/polyimide substrates exceeding 300 lines per inch) by pattern electroless plating with a relatively simple, inexpensive and well-controlled process without the need for electroplating or a photosensitive dielectric.
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