| http://www.w3.org/ns/prov#value | - BRIEF DESCRIPTION OF THE DRAWINGS [0024]FIG. 1 is a schematic cross sectional view illustrating a main portion of the steps of manufacturing a semiconductor device according to Example 1 of this invention. [0025]FIG. 2 is a diagram illustrating the electric field strength dependence of dielectric breakdown lifetime at a portion between adjacent copper wiring. [0026]FIG. 3 is a diagram illustrating
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