| http://www.w3.org/ns/prov#value | - BRIEF DESCRIPTION OF THE DRAWINGS [0038]FIG. 1 is a top schematic representation of a first embodiment of an assembly according to the present invention, which includes a semiconductor die with bond pads electrically connected to the contact pads of a carrier substrate by way of the intermediate conductive elements of the present invention; [0039]FIG. 2 is a cross-section taken along line 2-2 of F
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