| http://www.w3.org/ns/prov#value | - Resist compositions of this invention may be applied, preferably as a liquid, to a substrate such as a silicon wafer, steel, aluminum, copper, cadmium, zinc, ceramic, glass, paper, wood or various plastic films such as poly(ethyleneterephthalate), plasticized poly(vinylchloride), polypropylene, polyethylene, polyimide, and the like, and irradiated and/or heated.
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