About: http://webisa.webdatacommons.org/270015067

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In one embodiment, chip module 306 is a ceramic or plastic package such as a flip chip or a grid array chip.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com