| http://www.w3.org/ns/prov#value | - With respect to the recent trend of the miniaturization and increased frequency of the PCB, a process of positioning the passive element, for example the capacitor, under an active chip of the laminated substrate, or a technology of forming a high dielectric layer in the PCB or multi-layered PCB, in which the high dielectric layer is used as the capacitor, is suggested, so as to mount the capacito
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