| http://www.w3.org/ns/prov#value | - FIG. 7 is a graph comparatively showing the variation of oxide film thickness when silicon wafers are subjected to an annealing process and different calibration lines differing from each other in slope and y-intercept are set respectively for the silicon wafers respectively having different surface roughnesses, and that of oxide film thickness when silicon wafers are subjected to an annealing pro
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