| http://www.w3.org/ns/prov#value | - . 5 performs electrolytic elution, while FIG. 7B is an enlarged view of the X portion in FIG. 7A. [0248] A wafer W comprised of a substrate 101 formed with an interconnection layer 105 as the surface to be polished is secured by a securing means such as a vacuum chuck and driven to rotate.
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