| http://www.w3.org/ns/prov#value | - G.9.* Cited by examinerReferenced byCiting PatentFiling datePublication dateApplicantTitleUS5525402 *Feb 24, 1995Jun 11, 1996Matsushita Electric Industrial Co., Ltd.Bump forming paste is metal oxide including copper oxide as major component and bumps are made of reduced and sintered body of paste; used for semiconductorsUS5700549 *Jun 24, 1996Dec 23, 1997International Business Machines Corporation
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