| http://www.w3.org/ns/prov#value | - Nikon and IME will collaborate on technologies such as multiple patterning and direct self assembly techniques to drive the extension of ArF Deep Ultraviolet (DUV) dry and immersion lithography down to geometry of 20 nm and beyond, targeting advanced applications including logic, high density memory, embedded non-volatile memory, high-speed electronics and nanophotonics, and nano-electromechanical
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