| http://www.w3.org/ns/prov#value | - BACKGROUND OF THE INVENTION [0001] 1.Field of the Invention [0002] The present invention relates to a semiconductor device and a semiconductor module, and relates in particular to a technique for preventing a defect due to the mismatching of thermal expansion coefficients when a semiconductor device is mounted on a substrate. [0003] 2.Description of the Related Art [0004] To produce a hybrid integ
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