| http://www.w3.org/ns/prov#value | - When the difference between the coefficients of thermal expansion of the semiconductor chips 1 a and 1 b, the module substrates 2 a and 2 b, and the mother board 4 is small, heat conduction member 6 can be made of the metals having high thermal conductivity such as copper, alumina, or thermosetting resins containing ceramics such as boron nitride, or carbon.
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