| http://www.w3.org/ns/prov#value | - Finally, following deposition of the barrier layer 112 an electrically conductive layer 114 is formed on the barrier layer 112 using conventional processes such as CVD, PVD or ALD. The deposition of the conductive layer is customarily followed by electroplating to fill the feature 104, or at least those portions of the feature not already filled with the under-layer and barrier layer, with conduct
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