About: http://webisa.webdatacommons.org/277421483

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In the embodiment of FIG. 3, the surfaces of integrated circuit die 12 and 14 opposite to the surface containing their I/O pads are mechanically bonded to first surface 88 of decal 16 by means such as conductive epoxy.
http://www.w3.org/ns/prov#wasQuotedFrom	patents.com