About: http://webisa.webdatacommons.org/278695153

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Stacked-die chip scale packages (CSPs) integrate an ASIC and memories such as flash, SRAM and DDR into one package by stacking probed good die, interconnecting them with wire bonding and molding all into one JEDEC-standard package.
http://www.w3.org/ns/prov#wasQuotedFrom	electroiq.com