| http://www.w3.org/ns/prov#value | - For example, the resist composition is applied to a substrate such as a silicon wafer so as to provide a film thickness of 0.5 to 2.0 ??m by a technique such as spin coating, and prebaked on a hot plate at a temperature of 60 to 150??? C. for 1 to 10 minutes, preferably 80 to 120??? C. for 1 to 5 minutes.
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