About: http://webisa.webdatacommons.org/281650361

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	These bond pads 14 may be used to electrically couple select conductors located on the respective semiconductor dies 12 a, 12 b to circuitry on one or more integrated circuits or other devices external to the MCM 10.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com