| http://www.w3.org/ns/prov#value | - For comparison, die-mounting is carried out in the same conditions for the conductive adhesive agent of the comparative example 2-1 in addition to the conductive adhesive agents of the examples 1-2,1-7 and 1-13 described above, and other steps are carried out in common to fabricate 4 kinds of resin mold type semiconductor devices in all.
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