PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • The encapsulation-mold cavity may be designed to ???step over??? interface contacts 33 (e.g., solder balls in a BGA or other contacts) attached to contact pads 63 before the molding process.
http://www.w3.org/ns/prov#wasQuotedFrom
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