| http://www.w3.org/ns/prov#value | - : ?? Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ?? Solder bath specifications, including temperature and impurities PTN3300B PTN3300B_1 Product data sheet ?? NXP B.V. 2008.
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