| http://www.w3.org/ns/prov#value | - BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS [0032] Examples of the invention are illustrated in the following figures, in which the dimensions are not necessarily shown to scale, wherein: [0033]FIG. 1 is a cutaway perspective view of one embodiment of a packaged semiconductor flip-chip die of the invention and a reduced scale view of a portion of a circular wafer from which the die is s
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