| http://www.w3.org/ns/prov#value | - FIG. 3 is a flow chart showing an embodiment of the thickness measuring method and wet etching method in the wet etching apparatus shown in FIG. 1.In this wet etching apparatus, when wet etching for the semiconductor wafer W is started in the wet etching apparatus B, thickness measurement is executed at each of a plurality of measurement times t at a predetermined time interval (step S101).
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