About: http://webisa.webdatacommons.org/291232922

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In addition, chip scale packages are designed for flip chip bonding to a supporting substrate, such as a package substrate, a module substrate or a printed circuit board (PCB).
http://www.w3.org/ns/prov#wasQuotedFrom	google.com