About: http://webisa.webdatacommons.org/292268698

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In conventional metallization processes for forming wirings and contacts for semiconductor devices such as the process described above, an aluminum film is deposited using a sputtering method to fill the wiring trench/contact hole.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com