About: http://webisa.webdatacommons.org/293324417

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In this manner, chips or other defects to the wafer edge, which may arise during grinding or lapping, are more likely to be removed.
http://www.w3.org/ns/prov#wasQuotedFrom	google.fr