PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • In other embodiments, the spaces between the hardmask pillars 1202, 1204, 1206 can be filled with a conductive material, such as aluminum, to form the conductive areas of the semiconductor in later processing steps.
http://www.w3.org/ns/prov#wasQuotedFrom
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