| http://www.w3.org/ns/prov#value | - rate and wafer scale interposer substrate member for use with flip-chip configured semiconductor diceUS712958416 Ene 200231 Oct 2006Micron Technology, Inc.Elimination of RDL using tape base flip chip on flex for die stackingUS714522517 May 20025 Dic 2006Micron Technology, Inc.Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods
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