| http://www.w3.org/ns/prov#value | - Broadly speaking the present invention is a method of forming an encapsulated array of solder balls on a first sample that may be bonded to contact pads on another sample, comprising the steps of: patterning a set of solder balls onto the first sample; coating the solder balls in a layer of an encapsulation material, where the encapsulation material substantially covers the set of solder balls dis
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