| http://www.w3.org/ns/prov#value | - r platen having an electrostatic clamp for improving the electrical contact between the platen and the wafer to increase the wafer cooling capability, suppress the wafer backside discharge and reduce wafer backside particle generation.SUMMARYAccording to a first aspect of the invention, an apparatus is provided for handling workpieces, such as semiconductor wafers, during semiconductor processing.
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