| http://www.w3.org/ns/prov#value | - Preferably, the bottom face 3 of the wafer 1 is thinned before sawing by grinding or other conventional means, after which an adhesive carrier film 4 is applied to the ground surface to maintain alignment and proximity of the chips on the wafer during dicing, transport and in subsequent applications. [0034]FIG. 2B is a cross section of a linear chip aggregation 101 in which the dicing is achieved
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