| http://www.w3.org/ns/prov#value | - Projection exposure apparatuses for manufacturing a semiconductor element such as IC, LSI and the like are generally categorized into a projection exposure apparatus of step-and-repeat type in which a reticle as a mask and shot areas of a wafer (or glass plate and the like) as a photosensitive substrate are positioned relative to each other in a predetermined positional relation by using a project
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