| http://www.w3.org/ns/prov#value | - r swatches; applying the tape as a micro-markable surface; applying the tape to a surface of a wafer after the wafer has been diced; applying the tape to all or selected portions of the back side of a wafer or die; applying the tape to a surface of any of the various semiconductor dice known in the art, such as DIP, SIP, ZIP, PLCC, SOJ, SIMM, DIMM, LCC, QFP, SOP, TSOP, flip-chip, etc; applying the
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