| http://www.w3.org/ns/prov#value | - Briefly, this process comprises: (1) grinding and lapping the access plane to expose the leads; (2) plasma etching the silicon on the access plane 28 to remove silicon around the leads, which remain protruding from the access plane; (3) coating the access plane with a passivation layer, using a material such as polyimide; and (4) lapping again to expose the leads, while the remainder of the access
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