| http://www.w3.org/ns/prov#value | - From the above, it can be understood that in the previous embodiments, the carrying structure may be a multi-layered structure with an organic resin adhesive layer, wherein the adhesive layer is hot pressed to firmly mount the electronic component in the supporting board(s) made of materials such as metal, ceramic, circuit board(s) with wiring structure or other dielectric materials, without the n
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