| http://www.w3.org/ns/prov#value | - r molded resin compound may have a planar upper surface.The lower molded resin compound may have an upper surface having a step difference, and upper regions of the lower molded resin compound corresponding to the first chips may have upper surfaces higher than other regions.The molded resin compound may include an epoxy molded compound.The connection conductors may be materials including tin (Sn)
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