| http://www.w3.org/ns/prov#value | - r layer having a melting point lower than that of the first solder layer, respectively, on the surface of the cap layer in ohmic contact with the cap layer; forming first solder layers at regions, including a region on which the semiconductor laser chip is to be mounted, of the surface of the heat sink having an upper electrode and a lower electrode on upper and lower surfaces, which regions are s
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