| http://www.w3.org/ns/prov#value | - Preferably, the refractory metal and refractory metal nitride do not readily form copper alloys, for example, at temperatures less than about 800??? C. Preferably, the refractory metal includes at least one of tantalum, titanium, tungsten, and the refractory metal nitride, nitrides thereof, for example TaN, TiN, and WN. The barrier layer 20A is preferably formed having a thickness between about 25
|
