About: http://webisa.webdatacommons.org/297101309

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The dual damascene process makes it possible for structures with two different depths to be structured in the substrate, for example contact holes and interconnects, as an inlay in the manner described.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com