PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • The insulation layer 126 may be planarized by a planarization process such as a CMP process, an etch back process, or a combination process of CMP and etch back until the first hard mask 114 is exposed.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.com