About: http://webisa.webdatacommons.org/297985845

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The present invention is a method of removing metallic residue after etching an MRAM film stack formed on a substrate (also referred to herein as a wafer) in a semiconductor substrate processing system.
http://www.w3.org/ns/prov#wasQuotedFrom	google.es