| http://www.w3.org/ns/prov#value | - lder bump containing tin, the solder bump pad on a top surface of the solder bump pad, the current spreading pad comprising one or more layers, at least one of the one or more layers consisting of a material that will not form an intermetallic with tin or at least one of the one or more layers is a material that is a diffusion barrier to tin and is adjacent to the solder bump pad.
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