| http://www.w3.org/ns/prov#value | - On the other hand, a multilayer interconnection of an LSI is formed by laminating an insulating film of for example silicon dioxide (SiO2) and a wiring of for example aluminum (Al) successively on a semiconductor of for example a silicon (Si) single crystal by vapor deposition or any other suitable method, and subjecting the layers formed to a desired etching.
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