PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • In accordance with the present invention, the above and other objects and advantages are provided by a packaging interconnect metallization scheme having excellent adhesion and barrier properties.
http://www.w3.org/ns/prov#wasQuotedFrom
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