| http://www.w3.org/ns/prov#value | - Thus, without adversely affecting on an output of the semiconductor laser, a semiconductor laser can be assembled with resin sealing while securing a space portion between the semiconductor laser and the printed circuit board. [0316] In the present invention, such as a sheet of a thermo-setting resin can be used as a sealing member during the sealing step, and, through melting and hardening a surf
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