| http://www.w3.org/ns/prov#value | - The condition after the peeling is shown in FIG. 3 (D). [0133] Next, only the second substrate 35 is removed. (FIG. 3(E)) Here, the second substrate is dissolved by soaking into a container which a mixed solution of hydrofluoric acid (HF) and sulfuric acid (H2SO4) is in. [0134] In this way, a semiconductor device comprising the layer 31 including an element, the binding material 32, and the etchin
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