| http://www.w3.org/ns/prov#value | - The invention is a method of manufacturing an integrated circuit including the steps of: (1) providing a wafer having a surface; (2) altering material properties, such as emissivity, absorptivity, and reflectivity, of at least one selected portion of the surface to alter heat flow in the portion by depositing at least one layer of film on the portion; (3) heating the wafer to an elevated temperatu
|
