| http://www.w3.org/ns/prov#value | - Therefore, the present invention is particularly useful for packages in which the solder resist surface of the mounting substrate is heavily populated with solder ball contact pads and/or and solder balls, and/or in applications where the chip outline is nearly the same size as the package (e.g., Chip Scale Packages (CSP), Near Chip Size (NCS), etc This invention differs significantly, in that the
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