| http://www.w3.org/ns/prov#value | - FIELD OF THE INVENTION [0001] The present invention relates to a vibration damping apparatus which reduces vibrations of a structure such as an exposure apparatus used to fabricate various devices such as a semiconductor chip including an IC or LSI, a display element including a liquid crystal panel, a detection element including a magnetic head, and an image sensing element including a CCD, a con
|
