| http://www.w3.org/ns/prov#value | - (3) The present invention is a method for manufacturing an optoelectric wiring substrate comprising the step of: forming a first through-hole in a substrate having an electric wiring; forming first clads on both surfaces of the substrate and filling a clad in the first through-hole; forming a second through-hole in the first through-hole which has a smaller inner diameter than the first through-ho
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